Research Papers

Modeling and Validation of a Web Ontology Language Based Disassembly Planning Information Model

[+] Author and Article Information
Bicheng Zhu

Department of Mechanical Engineering,
Syracuse University,
900 South Crouse Ave.,
Syracuse, NY 13244
e-mail: bizhu@syr.edu

Utpal Roy

Department of Mechanical Engineering,
Syracuse University,
900 South Crouse Ave.,
Syracuse, NY 13244
e-mail: uroy@syr.edu

1Corresponding author.

Contributed by the Computers and Information Division of ASME for publication in the JOURNAL OF COMPUTING AND INFORMATION SCIENCE IN ENGINEERING. Manuscript received September 23, 2017; final manuscript received March 25, 2018; published online April 30, 2018. Editor: Satyandra K. Gupta.

J. Comput. Inf. Sci. Eng 18(2), 021015 (Apr 30, 2018) (11 pages) Paper No: JCISE-17-1194; doi: 10.1115/1.4039849 History: Received September 23, 2017; Revised March 25, 2018

Disassembly, a process of separating the end of life (EOL) product into discrete components for re-utilizing their associated residual values, is an important enabler for the sustainable manufacturing. This work focuses on the modeling of the disassembly planning related information and develops a disassembly information model (DIM) based on an extensive investigation of various informational aspects in the domain of disassembly planning. The developed DIM, which represents an appropriate systematization and classification of the products, processes, uncertainties, and degradations related information, follows a layered modeling methodology in which DIM is subdivided into layers with the intent to separate general knowledge into different levels of abstractions and reach a balance between information reusability and information usability. Two prototype disassembly planning related applications have been incorporated to validate the usability and reusability of the developed DIM.

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Clegg, A. J. , and Williams, D. J. , 1994, “The Strategic and Competitive Implications of Recycling and Design for Disassembly in the Electronics Industry,” IEEE International Symposium on Electronics and the Environment (ISEE), San Francisco, CA, May 2–4, pp. 6–12.
Ilgin, M. A. , and Gupta, S. M. , 2010, “Environmentally Conscious Manufacturing and Product Recovery (ECMPRO): A Review of the State of the Art,” J. Environ. Manage., 91(3), pp. 563–591. [CrossRef] [PubMed]
Grenchus, E. , Keene, R. , and Nobs, C. , 1997, “Demanufacturing of Information Technology Equipment,” IEEE International Symposium on Electronics and the Environment (ISEE), San Francisco, CA, May 5–7, pp. 157–160.
Ridder, C. , and Scheidt, L. , 1998, “Practical Experience in the Sony Disassemly Evaluation Workshop,” IEEE International Symposium on Electronics and the Environment (ISEE), Oak Brook, IL, May 4–6, pp. 94–98.
Wang, L. , Wang, X. V. , Gao, L. , and Váncza, J. , 2014, “A Cloud-Based Approach for WEEE Remanufacturing,” CIRP Ann.-Manuf. Technol., 63(1), pp. 409–412. [CrossRef]
PENEV, K. D. , PENEV, K. D. , and de RON, A. J. , (02). “Determination of a Disassembly Strategy,” Int. J. Prod. Res., 34(2), pp. 495–506. [CrossRef]
Zhang, H. C. , and Kuo, T. C. , 1996, “A Graph-Based Approach to Disassembly Model for End-of-Life Product Recycling,” Nineteenth IEEE/CPMT Electronics Manufacturing Technology Symposium, Austin, TX, Oct. 14–16, pp. 247–254.
Murayama, T. , Oba, F. , Abe, S. , and Yamamichi, Y. , 2001, “Disassembly Sequence Generation Using Information Entropy and Heuristics for Component Replacement,” IEEE International Symposium on Assembly and Task Planning, Fukuoka, Japan, May 28–29, pp. 208–213.
Kanai, S. , Sasaki, R. , and Kishinami, T. , 1999, “Graph-Based Information Modeling of Product-Process Interactions for Disassembly and Recycle Planning,” First International Symposium on Environmentally Conscious Design and Inverse Manufacturing (EcoDesign), Tokyo, Japan, Feb. 1–3, pp. 772–777.
Lambert, A. J. D. , 1997, “Optimal Disassembly of Complex Products,” Int. J. Prod. Res., 35(9), pp. 2509–2524. [CrossRef]
Zussman, E. , and Zhou, M. C. , 2000, “Design and Implementation of an Adaptive Process Planner for Disassembly Processes,” IEEE Trans. Rob. Autom., 16(2), pp. 171–179. [CrossRef]
Zussman, E. , Zhou, M.-C. , and Caudill, R. , 1998, “Disassembly Petri Net Approach to Modeling and Planning Disassembly Processes of Electronic Products,” IEEE International Symposium on Electronics and the Environment (ISEE), Oak Brook, IL, May 4–6, pp. 331–336.
Moore, K. E. , Gungor, A. , and Gupta, S. M. , 1998, “A Petri Net Approach to Disassembly Process Planning,” Comput. Ind. Eng., 35(1–2), pp. 165–168. [CrossRef]
Hsin-Hao, H. , Wang, M. H. , and Johnson, M. R. , 2000, “Disassembly Sequence Generation Using a Neural Network Approach,” J. Manuf. Syst., 19(2), pp. 73–82. [CrossRef]
Zhu, B. , 2016, “An Information Model in the Domain of Disassembly Planning for Sustainable Manufacturing,” Doctoral dissertation, Syracuse University, Syracuse, NY.
Gruber, T. R. , 1995, “Toward Principles for the Design of Ontologies Used for Knowledge Sharing?,” Int. J. Hum.-Comput. Stud., 43(5–6), pp. 907–928. [CrossRef]
Galster, M. , and Avgeriou, P. , 2012, “A Variability Viewpoint for Enterprise Software Systems,” Joint Working IEEE/IFIP Conference on Software Architecture (WICSA 2012) & European Conference on Software Architecture (ECSA 2012), Helsinki, Finland, Aug. 20–24, pp. 267–271.
Gennari, J. H. , Musen, M. A. , Fergerson, R. W. , Grosso, W. E. , Crubezy, M. , Eriksson, H. , and Tu, S. W. , 2003, “The Evolution of Protege: An Environment for Knowledge-Based Systems Development,” Int. J. Hum.-Comput. Stud., 58(1), pp. 89–123. [CrossRef]


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Fig. 1

The overall structure of DIM

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Fig. 2

Product information model for the disassembly planning

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Fig. 3

Comparisons between the graph model and the product model

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Fig. 4

The overall structure of the process model

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Fig. 5

AND/OR graph of a product

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Fig. 6

Comparison between the process model and the N-ary relation model

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Fig. 7

The structure of the uncertainty model

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Fig. 12

An example of the ContactLoopCluster concept

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Fig. 11

Examples of the Contactloop concept

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Fig. 10

Disassembly sequence generator information model

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Fig. 9

Product geometrical configuration: (a) example 1 and (b) example 2

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Fig. 8

Product topological configuration

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Fig. 13

Disassembly sequence generator application

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Fig. 14

Disassembly sequence generation process

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Fig. 15

An illustrative example



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