Technical Briefs

Multistack Close Range Photogrammetry for Low Cost Submillimeter Metrology

[+] Author and Article Information
L. M. Galantucci

e-mail: galantuc@poliba.it

F. Lavecchia

e-mail: f.lavecchia@poliba.it

G. Percoco

e-mail: g.percoco@poliba.it
Dipartimento di Meccanica,
Matematica e Management,
Politecnico di Bari,
Viale Japigia 182,
Bari 70126, Italy

Contributed by the Computers and Information Division of ASME for publication in the Journal of Computing and Information Science in Engineering. Manuscript received March 12, 2013; final manuscript received June 27, 2013; published online August 19, 2013. Assoc. Editor: Xiaoping Qian.

J. Comput. Inf. Sci. Eng 13(4), 044501 (Aug 19, 2013) (4 pages) Paper No: JCISE-13-1045; doi: 10.1115/1.4024973 History: Received March 12, 2013; Revised June 27, 2013

Considerable research effort has been focused on evaluating the accuracy of meso- and macroscale digital close range photogrammetry. However, evaluations of accuracy and applications in the submillimeter scale are rare. In this paper the authors propose the development of a three-dimensional (3D) photogrammetric scanner, based on macrolens cameras, able to reconstruct the three-dimensional surface topography of objects with submillimeter features. The system exploits multifocal image composition and has been designed for installation on all types of Numerical Controlled or Robotic systems. The approach is exploitable for digitizing submillimeter features at mesoscale as well as macroscale objects.

Copyright © 2013 by ASME
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Fig. 1

The CNC microphotogrammetric system

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Fig. 2

Example of photogrammetric mapping of a 18.6 mm × 36.2 mm workpiece

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Fig. 3

The chosen benchmarks

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Fig. 4

The textured 3D model for workpiece C

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Fig. 5

Colored maps describing deviations (mm) in the workpieces




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