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Research Papers

Disassembly Process Information Model for Remanufacturing

[+] Author and Article Information
Ram D. Sriram

National Institute of Standards and Technology,
Gaithersburg, MD 20899

Hanmin Lee

Korea Institute of Machinery and Materials,
Daejeon, 305-343, Korea

Che B. Joung

Korea Institute of Industrial Technology,
Cheonan, ChungCheongnam-do, 331-822, Korea

Parisa Ghodous

University of Claude Bernard Lyon I,
Lyon, 69622, Villeurbanne Cedex, France

Note that the font style of an abstract class name is italic and that the first letter of the abstract class name is capitalized.

Note that the font style of an attribute name is italic and that the first letter of the attribute name is in lower case.

MeasureWithUnit is defined in NIST Interagency Report (NISTIR) 7772 [14].

Identification is defined in NISTIR 7772 [14].

LengthMeasure is defined in NISTIR 7772 [13].

PositiveInteger is defined in NISTIR 7772 [13].

UnitVector3D is defined in NISTIR 7772 [13].

A type in bold italic font denotes a UML defined type.

String is defined in NISTIR 7772 [14].

ReportingRequirement is defined in NISTIR 7772 [14].

SamplingStrategy is defined in NISTIR 7772 [14].

Tolerance is defined in NISTIR 7772 [14].

Contributed by the Computers and Information Division of ASME for publication in the Journal of Computing and Information Science in Engineering. Manuscript received April 10, 2013; final manuscript received April 28, 2013; published online June 20, 2013. Editor: Bahram Ravani.

J. Comput. Inf. Sci. Eng 13(3), 031004 (Jul 20, 2013) (18 pages) Paper No: JCISE-13-1071; doi: 10.1115/1.4024543 History: Received April 10, 2013; Revised April 28, 2013

Disassembly is essential to dismantle a product for remanufacturing during maintenance or at the end of service life. The National Institute of Standards and Technology (NIST) has developed an information model for describing disassembly processes. A disassembly process includes many subprocesses, such as separation, cleaning, repair, replacement, and inspection. This paper describes a disassembly process information model with the following key components: workpiece, material content, equipment, and workflow. The workflow aspect supports the modeling of operations, operation sequences, branching an operation into multiple ones, and joining multiple operations into one. The model provides a foundation for computer-aided disassembly software systems development.

Copyright © 2013 by ASME
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References

Jovane, F., Yoshikawa, H., Alting, L., Boer, C., Westkamper, E., Williams, D., Tseng, M., Seliger, G., and Paci, A., 2008, “The Incoming Global Technical and Industrial Revolution Towards Competitive Sustainable Manufacturing,” CIRP Ann., 57, pp. 641–659. [CrossRef]
Brundtland, G., 1987, Our Common Future, World Commission on Environment and Development, Oxford University Press, United Kingdom.
Subramoniam, R., Huisingh, D., and Chinnam, R., 2010, “Aftermarket Remanufacturing Strategic Planning Decision-Making Framework: Theory & Practice,” J. Cleaner Prod., 18, pp. 1575–1586. [CrossRef]
Nasr, N., and Thurston, M., 2006, “Remanufacturing: A Key Enabler to Sustainable Product Systems,” Proceedings of the 13th CIRP International Conference on Life Cycle Engineering, Leuven, Belgium, pp. 15–18.
Sriram, R., Navinchandra, D., and Allen, R., 2000, “Environmental Issues in Collaborative Design,” Mechanical Life Cycle Handbook: Good Environmental Design and Manufacturing, M.Hundal, ed., Mercel Dekker, Inc., New York.
Rifer, W., Brody-Heine, P., Peters, A., and Linnell, J., 2009, Closing the Loop Electronics Design to Enhance Reuse/Recycling Value, The Green Electronics Council, Portland, Oregon.
Jofre, S., and Morioka, T., 2005, “Waste Management of Electric and Electronic Equipment: Comparative Analysis of End-of-Life Strategies,” J. Mater. Cycles Waste Manage., 7, pp. 24–32. [CrossRef]
Kumar, V., and Sutherland, J., 2008, “Sustainability of the Automotive Recycling Infrastructure: Review of Current Research and Identification of Future Challenges,” Int. J. Sustainable Manuf., 1(1–2), pp. 145–167.
Bogue, R., “Design for Disassembly: A Critical Twenty-First Century Discipline,” Assem. Autom., 27(4), pp. 285–289, 2007. [CrossRef]
M’Saoubi, R., Outeiro, J., Chandrasenkaran, H., DillonO., and Jawahir, I., 2008, “A Review of Surface Integrity in Machining and Its Impact on Functional Performance and Life of Machined Products,” Int. J. Sustainable Manuf., 1(1–2), pp. 203–236.
MIT Sloan Management Review and Boston Consulting Group, 2011, “Sustainability: The ‘Embracers’ Seize Advantage,” MIT Sloan Management Review Research Report, Winter, 2011. Available at: http://c0426007.cdn2.cloudfiles.rackspacecloud.com/MIT-SMR-BCG-sustainability-the-embracers-seize-advantage-2011.pdf
Ilgin, M., and Gupta, S., 2010, “Environmentally Conscious Manufacturing and Product Recovery (ECMPRO): A Review of the State of the Art,” J. Environ. Manage., 91, pp. 563–591. [CrossRef] [PubMed]
Rumbaugh, J., Jacobson, I., and Booch, G., 1999, The Unified Modeling Language Reference Manual, Addison-Wesley, Boston, MA.
Feng, S., Lee, H., Joung, C., Kramer, T., Ghodous, P., and Sriram, R., 2011, “Information Model for Disassembly for Reuse, Recycling, and Remanufacturing,” National Institute of Standards and Technology, NISTIR 7772, Gaithersburg, MD.
Tang, Y., Zhou, M., and Caudill, R., 2000, “An Integrated Approach to Disassembly Planning and Demanufacturing Operation,” Proceedings of 2000 IEEE International Symposium on Electronics and the Environment, pp. 354–359.
Lee, K., and Gadh, R., 1996, “Computer Aided Design for Disassembly: A Destructive Approach,” Proceedings of the IEEE International Symposium on Electronics and the Environment, May, pp. 173–178.
Desai, A., and Mital, A., 2003, “Evaluation of Disassemblability to Enable Design for Disassembly in Mass Production,” Int. J. Ind. Ergon., 32, pp. 265–281. [CrossRef]
Desai, A., and Mital, A., 2005, “Incorporating Work Factors in Design for Disassembly in Product Design,” J. Manuf. Technol. Manage., 16(7), pp. 712–732. [CrossRef]
Ijomah, W., McMahon, C., Hammond, G., and Newman, S., 2007, “Development of Design for Remanufacturing Guidelines to Support Sustainable Manufacturing,” J. Rob. Comput. -Integr. Manuf., 23, pp. 712–719. [CrossRef]
Seliger, G., 2007, Sustainability in Manufacturing: Recovery of Resources in Product and Material Cycles,” Springer, New York.
Homem de Mello, L. S., and Sanderson, A. C., 1990, “AND/OR Graph Representation of Assembly Plans,” IEEE Trans. Rob. Autom., 6(2), pp. 188–100. [CrossRef]
Lambert, A., 1997, “Optimal Disassembly of Complex Products,” Int. J. Prod. Res., 35(9), pp. 2509–2523. [CrossRef]
Lambert, A., 2003, “Disassembly Sequencing: A Survey,” Int. J. Prod. Res., 41(16), pp. 3721–3759. [CrossRef]
Lambert, A., and Gupta, S., 2005, “Disassembly Modeling for Assembly, Maintenance, Reuse, and Recycling,” CRC Press, Boca Raton, FL.
Moore, K., Gungor, R., and Gupta, S., 1998, “Disassembly Process Planning Using Petri Nets,” Proceedings of 1998 IEEE Conference on Electronics and the Environment, pp. 88–93.
Zussman, E., and Zhou, M., 2000, “Design and Implementation of an Adaptive Process Planner for Disassembly Processes,” IEEE Trans. Rob. Autom., 16(2), pp. 171–179. [CrossRef]
Tang, Y., Zhou, M., Zussman, E., and Caudill, R., 2000, “Disassembly Modeling, Planning, and Application: A Review,” Proceedings of the IEEE International Conference on Robotics & Automation, April, San Francisco, CA, pp. 2197–2202.
Kuo, T., Zhang, H., and Huang, S., 2000, “Disassembly Analysis for Electromechanical Products: A Graph-Based Heuristic Approach,” Int. J. Prod. Res., 38(5), pp. 993–1007. [CrossRef]
Li, J., Khoo, L., and Tor, S., 2002, “A Novel Representation Scheme for Disassembly Sequence Planning,” Int. J. Manuf. Technol., 20, pp. 621–630. [CrossRef]
Li, J. R.Khoo, L. P., and Tor, S. B., 2005, “An Object-Oriented Intelligent Disassembly Sequence Planner for Maintenance,” Comput. Ind., 56, pp. 699–718. [CrossRef]
ISO 10303-44, 1994, Industrial Automation Systems and Integration—Product Data Representation and Exchange—Part 44: Integrated Generic Resources: Product Structure.
Sugimura, N., and Ohtaka, A., 2000, “ISO TC 184/SC4/WG12 N597, JNC Proposal of STEP Assembly Model for Products (June 2000),” ISO.
Sudarsan, R., Han, Y., Feng, S., Roy, U., Wang, F., Sriram, R., and Lyons, K., 2003, Object Oriented Representation of Electro-Mechanical Assemblies Using UML, National Institute of Standards and Technology, NISTIR 7057, Gaithersburg, MD.
Vinodh, S., Nachiappan, N., and Kumar, R., 2011, “Sustainability Through Disassembly Modeling, Planning, and Leveling: A Case Study,” Journal of Clean Technologies and Environmental Policy, Published online by Springer-Verlag 14(1), pp. 55–67. [CrossRef]
ISO 1302, 2002, Geometrical Product Specifications (GPS)—Indication of Surface Texture in Technical Product Documentation, International Organization for Standardization, Geneva, Switzerland.
ISO 10360-1, 2000, Geometrical Product Specifications—Acceptance and Reverification Tests for Coordinate Measuring Machines, Part 1: Vocabulary, International Organization for Standardization, Geneva, Switzerland.
ANSI/ASME B89.1.12M, 1985, Methods for Performance Evaluation of Coordinate Measuring Machines, The American Society of Mechanical Engineers, New York.
ISO 10360-2, 2009, Geometrical Product Specifications—Acceptance and Reverification Tests for Coordinate Measuring Machines (CMM)—Part 2: CMMs Used for Measuring Linear Dimensions, International Organization for Standardization, Geneva, Switzerland.

Figures

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Fig. 1

Disassembly information sharing

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Fig. 2

Class diagram of WorkpiecePack

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Fig. 3

Class diagram of EquipmentPack

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Fig. 4

Class diagram of SeparationEquipmentPack

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Fig. 5

Class diagram of CleaningEquipmentPack

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Fig. 6

Class diagram of DMEPack

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Fig. 7

Class diagram of WorkflowPack

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Fig. 8

Class diagram of BooleanPack

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Fig. 9

Class diagram of mathematical Comparison

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Fig. 10

Class diagram of OperationPack

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Fig. 11

Class diagram of CleaningOperationPack

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Fig. 12

Assembly hierarchy of car suspension module

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Fig. 14

Instance diagram of the car suspension module assembly

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Fig. 15

Instance diagram of a subassembly (detailed)

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Fig. 16

Disassembly sequence of the car suspension module

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Fig. 17

Relation between disassembly sequence and connection graph

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Fig. 18

Relation between disassembly sequence and connection graph

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Fig. 19

Assembly sequence of flip-top cell phone in a tree structure

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Fig. 21

Instance diagram of a cell phone

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Fig. 22

Disassembly sequence of a cell phone

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Fig. 23

Instance diagram of the disassembly sequence of a cell phone

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