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TECHNICAL PAPERS

Empirical Studies on Inter-Organizational Collaborative Product Development

[+] Author and Article Information
Chih-Hsing Chu1

Product Realization Lab, Department of Industrial Engineering and Engineering Management, National Tsing Hua University, Hsinchu 300, Taiwan

Chia-Jung Chang, Han-Chung Cheng

Product Realization Lab, Department of Industrial Engineering and Engineering Management, National Tsing Hua University, Hsinchu 300, Taiwan

1

Corresponding author.

J. Comput. Inf. Sci. Eng 6(2), 179-187 (Apr 10, 2006) (9 pages) doi:10.1115/1.2202870 History: Received February 14, 2005; Revised April 10, 2006

Collaborative product development (CPD) has become an imperative for companies to strengthen their niche values and remain competitive in the global market. However, most scholars may lack knowledge of deploying CPD in current industrial settings, and their research efforts may thus fail to fulfill practical needs. This paper presents a series of empirical case studies on distributed product development in Asia-Pacific Region. Engineering collaborations among brand-owner, manufacturer, and supplier in six product design chains (desktop PC, IC substrate, LCD monitor, bicycle, mold design, and CPU cooler) are under investigation. A systematic approach is developed that categorizes CPD into three modes based on the number of engineering BOM items and the difficulty of modularization in product design. It provides a preliminary but structured template for CPD deployment by characterizing the implications and software features of each mode. The cases also reveal values which CPD creates for the downstream supplier of a global value chain and new IT technologies enabling the collaboration process. This work is one of the early studies that analyze collaborative product development from the perspective of a manufacturer. The findings complement and corroborate theoretical studies in related research.

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Copyright © 2006 by American Society of Mechanical Engineers
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Figures

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Figure 1

Collaboration process in the PC development chain

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Figure 2

Collaboration process in the IC substrate development chain

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Figure 3

Collaboration process in the LCD monitor development chain

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Figure 8

Mechanical design, electronics design, and system integration modes

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Figure 7

Classification of the CPD practices

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Figure 6

Collaborations in the CPU cooler development chain

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Figure 5

Collaboration process in the mold development chain

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Figure 4

Collaborations in the bicycle development chain

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